Senior Product Applications Engineer II

Regional technical authority for next-generation AI and HPC infrastructure, owning technical strategy, solution architecture, customer engagement, and ecosystem development for advanced liquid cooling technologies across hyperscale, enterprise AI, and HPC deployments. Recognized as a trusted technical advisor to consultants, hyperscalers, Specialized Datacentre EPCs, engineering firms, and strategic customers covering full project technical lifecycle – from specification and technology selection to tendering, value engineering, Ecosystem upskilling and award. 2.1 Technical Leadership ▪ Act as regional technical authority for AI-ready DC infrastructure and liquid cooling; lead technical development of AI/HPC projects requiring high-density environments. ▪ Define/ Deploy reference architectures and best practices; establish technical governance for liquid cooling deployment; support executive leadership on technology strategy and competitive positioning. 2.2 AI & Liquid Cooling Expertise ▪ Direct-to-Chip (D2C), Rear Door Heat Exchangers (RDHx), Immersion Cooling, TCS and Secondary Network Heat (SFN) loops, CDU architecture & facility heat exchanger FWS design . ▪ Glycol/water loop engineering, hydraulic balancing, pumping systems, thermal management, heat rejection, water/ Mix Liquid quality management, facility hydraulic integration. ▪ Optimize air/liquid capture ratio, air-to-hybrid transition strategies, AI rack thermal management, high-density racks (>80–150+ kW/rack), thermal resilience, redundancy and energy efficiency. 2.3 AI Infrastructure Design ▪ Lead design for AI Pods, GPU clusters, NVIDIA HGX/MGX, NVL platforms, large GPU clusters, HPC and AI Factory architectures, high-density white space. ▪ Rack architecture, containment, high-performance airflow, power distribution integration, 800VDC-ready infrastructure, busbar systems, AI-ready POD compute topology, mechanical-electrical integration. 2.4 Presales & Specification Leadership ▪ Support Sales, coach BD teams, enable Presales, influence consultants, engineering firms, EPC / DCS contractors, hyperscalers and AI ecosystem partners. ▪ Lead specification development, design reviews, technology positioning, competitive differentiation, customer workshops, executive presentations and design validation. 2.5 Tendering & Value Engineering ▪ Own the full technical tendering process: qualification, architecture validation, risk assessment, design optimization, compliance review, value/cost engineering, technical negotiations, bid defense, customer clarifications and final technical approvals through to award. 2.6 Customer & Ecosystem Engagement ▪ Build trusted relationships with hyperscalers, enterprise customers, AI infrastructure providers, consultants, design institutes, EPC/mechanical contractors and channel partners. ▪ Represent the organization at executive workshops, industry conferences, technical seminars, customer advisory sessions and AI technology forums. • Required Competencies & Technical Expertise AI Infrastructure: GPU infrastructure, HPC architecture, AI Factory design, large-scale AI clusters, rack density optimization, thermal management, AI-ready electrical infrastructure. Critical DC Infrastructure Tier III/IV architectures, white space & containment, precision cooling, chilled water, CRAH/CRAC, in-row cooling, RDHx, high-availability mechanical systems, mission-critical redundancy. DC infrastructure Digital Twin, Desing simulation, DCS Software stack Liquid Cooling Direct Liquid Cooling & Immersion Cooling, TCS/SFN, CDU technologies, heat exchangers, hydraulic systems, pumping stations, thermal modeling/CFD, heat recovery concepts. Electrical Distribution 800VDC technologies, High density Power train architecture, integrated Compute critical infrastructure AI POD Skid . Industry knowledge: Vertiv, ABB, Schneider Electric, Carrier, Johnson Controls, STULZ, Munters, LiquidStack, CoolIT Systems, Motivair, Boyd, Submer, GRC, nVent, Delta Electronics, Huawei Digital Power, Equinix reference architectures, NVIDIA AI Infrastructure ecosystem. ▪ 12–15+ years in mission-critical data center infrastructure; minimum 7 years dedicated to high-density cooling technologies. ▪ Demonstrated experience on AI/HPC infrastructure projects and proven expertise in liquid cooling architecture and deployment. ▪ Extensive experience leading technical tendering and value engineering; strong customer-facing experience with hyperscalers, enterprise accounts, EPCs and consulting firms. ▪ Demonstrated success influencing technical specifications and securing major infrastructure projects. ▪ Recognized technical authority for AI cooling technologies; mentor regional presales/engineering organizations; build technical competency and drive innovation and technology adoption across the region. ▪ Deliver: regional AI/liquid cooling technical strategy, standardized AI reference architectures, technical enablement of sales/BD/presales, consultant and specification engagement plans, and technical ownership of strategic AI opportunities. ▪ Deliver: end-to-end tendering and value engineering leadership, regional design guidelines and enginee Rewards designed for you Our Total Rewards is our way of saying: We see you and we value you. It’s more than just pay and benefits—it’s a meaningful investment in you. It is designed to help you perform, grow, feel safe, and elevate your potential. The package helps you care for yourself and your family, plan your future, grow your skills and career, collaborate in an inclusive workplace, and contribute to your community. At Schneider Electric, we’re here for what matters most to you. Discover more at our Career Page. • Country-specific programs and initiatives may be available. Looking to make an IMPACT with your career? When you are thinking about joining a new team, culture matters. At Schneider Electric, our values and behaviors are the foundation for creating a great culture to support business success. We believe that our IMPACT values – Inclusion, Mastery, Purpose, Action, Curiosity, Teamwork – starts with us. IMPACT is also your invitation to join Schneider Electric where you can contribute to turning sustainability ambition into actions, no matter what role you play. It is a call to connect your career with the ambition of achieving a more resilient, efficient, and sustainable world. We are looking for IMPACT Makers; exceptional people who turn sustainability ambitions into actions at the intersection of automation, electrification, and digitization. We celebrate IMPACT Makers and believe everyone has the potential to be one. Become an IMPACT Maker with Schneider Electric – apply today! €40 billion global revenue +9% organic growth 150 000+ employees in 100+ countries You must submit an online application to be considered for any position with us. This position wi

12–15+ years in mission-critical data center infrastructure; minimum 7 years dedicated to high-density cooling technologies. Demonstrated experience on AI/HPC infrastructure projects and proven expertise in liquid cooling architecture and deployment. Extensive experience leading technical tendering and value engineering; strong customer-facing experience with hyperscalers, enterprise accounts, EPCs and consulting firms. Demonstrated success influencing technical specifications and securing major infrastructure projects. Recognized technical authority for AI cooling technologies; mentor regional presales/engineering organizations; build technical competency and drive innovation and technology adoption across the region. Deliver: regional AI/liquid cooling technical strategy, standardized AI reference architectures, technical enablement of sales/BD/presales, consultant and specification engagement plans, and technical ownership of strategic AI opportunities. Deliver: end-to-end tendering and value engineering leadership, regional design guidelines and enginee

Regional technical authority for AI-ready DC infrastructure, lead technical development of AI/HPC projects requiring high-density environments. Define/deploy reference architectures and best practices; establish technical governance for liquid cooling deployment; support executive leadership on technology strategy and competitive positioning. Lead design for AI Pods, GPU clusters, NVIDIA HGX/MGX, NVL platforms, large GPU clusters, HPC and AI Factory architectures, high-density white space. Rack architecture, containment, high-performance airflow, power distribution integration, 800VDC-ready infrastructure, busbar systems, AI-ready POD compute topology, mechanical-electrical integration. Lead specification development, design reviews, technology positioning, competitive differentiation, customer workshops, executive presentations and design validation. Own the full technical tendering process: qualification, architecture validation, risk assessment, design optimization, compliance review, value/cost engineering, technical negotiations, bid defense, customer clarifications and final technical approvals through to award. Build trusted relationships with hyperscalers, enterprise customers, AI infrastructure providers, consultants, design institutes, EPC/mechanical contractors and channel partners. Represent the organization at executive workshops, industry conferences, technical seminars, customer advisory sessions and AI technology forums.